180M€/650 persons) which manufactures special industrial glues and inks with high added value, applied in electronics markets for aeronautical, aerospace, automobile industries and also in the telecommunications, semiconductors and smart-cards.
PROTAVIC INTERNATIONAL has developed an expertise on segments and niche andoffers solutions such as die-attach materials, underfills, glob-top, dam & fill encapsulants, as well as coatings and potting resins.
Chemistries offered include epoxies, polyurethanes, silicones, polyimides, acrylates, as well as several UV curing technologies.
DAM/FILL & GLOB TOP
Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP, BGA and/or other semiconductor component. Dam&Fill materials improve the reliability of the package, and help in reducing warpage. As such, the components will resist to physical thermal stress, as well as improve resistance against moisture and chemicals.
Glob Top encapsulants have the same purpose as Dam & Fill materials. Where Dam & Fill encapsulants are typically used for larger die applications, Glob Top encapsulants are used in case of smaller chips. Our range covers materials with high Tg and low CTE
COATING, ENCAPSULANT AND POTTING COMPOUNDS APPLICATIONS
Potting compounds are pourable insulating resins (epoxies, silicones, urethanes and hybrids) to be cast into cavities containing electronic components to insulate, protect, and hold them in place thus protecting components from shock and vibration.
Sensitive components on PCB’s require protection against external factors such as humidity, dust, chemicals, etc. Also LED assemblies require potting compounds, which require resistyellowing in harsh environments such as UV exposure, heat, etc.
PROTAVIC INTERNATIONAL offers UL94-V0 flame retardant materials, based on different chemistries (polyurethane, epoxy, silicone, acrylics). In addition, a range of UV-curable, solvent-free coatings have been developed suitable for high temperature applications.
The die attach process involves affixing silicon die or chips to a lead frame or other substrate with adhesive, either electrically conductive, or dielectric. PROTAVIC INTERNATIONAL offers a range of adhesive pastes specifically designed for this application. The die attach materials have been designed, using different chemistries depending the end application and requirements. Our portfolio for die attach includesepoxies, acrylics, polyimides, as well as hybrids.
RFID antennas are often printed by stencil printing on low temperature substrates such as paper, Teslin, PET and/or PVC. For those applications, PROTAVIC INTERNATIONAL has developed a range of low temperature cure conductive inks These combine flexibility with good conductivity, making them ideally suitable for
applications such as RIFD antennas
THE INTERNATIONAL PRESENCE OF PROTAVIC INTERNATIONAL
PROTAVIC INTERNATIONAL constituted a network of subsidiaries to get closer to its local customers
- PROTAVIC AMERICA Inc.
- PROTAVIC CHINA
- PROTAVIC KOREA